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Homework answers / question archive / ENG60404 NUMERICAL METHODS AND DATA ANALYSIS A statistical analysis was used to develop nitride etch process on a single-wafer plasma etching tool

ENG60404 NUMERICAL METHODS AND DATA ANALYSIS A statistical analysis was used to develop nitride etch process on a single-wafer plasma etching tool

Electrical Engineering

ENG60404 NUMERICAL METHODS AND DATA ANALYSIS

A statistical analysis was used to develop nitride etch process on a single-wafer plasma etching tool. Plasma etching is a form of laser etching processing used to fabricate integrated circuit boards that is often found in many electrical devices. An integrated circuit is also known as microcontroller and microprocessor. The nitride etch process involves a  high-speed stream of laser discharge being shot in pulses at a wafer sample. The design factor is to distinguish the interaction between the two factors: (A) gap between the electrodes, and (B) Radio Frequency (RF) power applied to the cathode. The measured

data is the etch rate in μm/hr tabulated in Table Q1. The hypothesis of this experiment is:

the faster the etching process, the better overall manufacturing process it will become.

Etching refers to the removal of material from the wafer surface. The process is usually

combined with lithography to select specific areas on the wafer from which material is to be

removed. Etching represents one way of permanently transferring the mask pattern from the

photoresist to the wafer surface. The complementary process to etching is deposition (or

growth), where new material is added. Unlike oxidation (or nitridation), where the underlying

silicone is consumed to form the oxide (nitride) layer, in deposition, new material is added

without consuming the underlying wafer as shown in Figure Q1. In other words, components

on the wafer are imprinted just by removing parts of the integrated circuit board.

Evaluate this experiment using the appropriate Statistical Analysis and the appropriate

Significant Level. Write a short technical report to study the effect etch rate of this

processing, and to an

 

• This is a take-home assignment based on reputable online journal research on the effect pipe components in incompressible fluid discharge. • For Question 1 section part (a), your report must include Introduction, Literature Review, Results (Calculation), Discussion, and Reference best relate to the objective and scenario given. • The calculation can be made using hand calculation, OR Ms Excel, OR Google Sheet, OR any software of your preference. You are allowed to mix them. • Use a minimal one (1) and maximum three (3) resources that you can find online to support your case study. • Use any referencing style that you prefer. • All work, be it hand calculation or software calculation, must be displayed clearly for marking purposes. • Turnitin similarity report is compulsory as suggested on the Cover Page

Question 2. a. Using data in Table Q2a, calculate f(4.7) by applying Newton’s Interpolating Polynomials of order 1 & 2. Choose the sequence of the points for your estimates to attain the best possible accuracy. Design and write MATLAB script and screenshot the results in your answer script. (33 marks) Table Q2a. x 1 2 2.5 3 4 5 f(x) 0 5 7 6.5 2 0 b. Consider the following nonlinear equation ?(?) = tan(??) − ? = 0 Compare the roots using the Newton Raphson method (guess value = 2) and Bisection method (guess value [2, 2.5]). Which of the two methods converges faster? Given that the exact solution is 2.0288. (17 marks) [Total: 50 marks] NOTE: • These codes and results must be screenshots from MATLAB Software/MATLAB Online/MATLAB Mobile, whichever convenient to you. [Total Mark

 

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