Fill This Form To Receive Instant Help

Help in Homework
trustpilot ratings
google ratings


Homework answers / question archive / Write an article on An Analysis of Growth Characteristics of Aluminum and Copper Films

Write an article on An Analysis of Growth Characteristics of Aluminum and Copper Films

Writing

Write an article on An Analysis of Growth Characteristics of Aluminum and Copper Films. It needs to be at least 1250 words. Physical vapor deposition, or PVD for short, is a term used to denote vacuum deposition processes where the coating material is passed into a vapor transport phase by a physical mechanism such as evaporation, sputtering or others, and the coating material then gets deposited onto a substrate surface to which it is transported (Thornton, 1988). Evaporation is one of the PVD techniques which have been used for film deposition since Faraday’s (1857) time.

The age of this technique dictates clearly that a lot of work has been done in this field, specifically on developing coatings on glass. This involves substrate cleaning, followed by choosing a method for evaporation of target and running the test under vacuum for a calculated time to obtain a certain thickness of film growth (Bach and Krause, 1997. Jackson and Ford, 1981). The intricacies of the method and the theory behind it are discussed in the next section.

The first step, evaporation, was carried out through Joule heating using a tungsten filament. Joule heating, in simple terms, is resistance heating, done through using wires of high resistance R which generate heat Q when current I is passed through them for time t. They follow the mathematical relation (Weisstein, 1996-2007) given below:

This heat is utilized for heating our target material. The choice of the heating wire depends on resistance, which needs to be high for high heat generation. Tungsten filaments are usually used for this purpose, though tantalum or molybdenum may also be used (Ohring, 1992). Special purpose evaporation techniques also use electron beam evaporation. The target to be evaporated is wrapped around the filaments or shaped in hollow cylinders to place the filament inside them.

Once the evaporation is carried out, the next important step is to get the material transported to the substrate surface. This depends on the mean free path of the gas molecules in the chamber.

Purchase A New Answer

Custom new solution created by our subject matter experts

GET A QUOTE